Copper Concentrate Powder
Copper Concentrate Powder
SINCHI WAYRA offers copper concentrate with a majority copper base component. Preparation of copper concentrate typically involves the removal of water from an copper solution. American Elements specializes in producing high purity Copper Concentrate with the smallest possible average grain sizes for use in preparation of pressed and bonded sputtering targets and in Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Metallic-Organic and Chemical Vapor Deposition (MOCVD).
Copper concentrate is similar to powder in that it is made up of minute, dry particles of pure substance. Concentrate is also useful in any application where high surface areas are desired such as water treatment and in fuel cell and solar applications. Nanoparticles also produce very high surface areas. Our standard Concentrate particle sizes average in the range of – 325 mesh, – 100 mesh, 10-50 microns and submicron (< 1 micron). We can also provide many materials in the nanoscale range. American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopoeia/British Pharmacopoeia) and follows applicable ASTM testing standards. Typical and custom packaging is available.
We also produce Copper as rod, ingot, pieces, pellets, disc, granules, wire, and in compound forms, such as oxide. Other shapes are available by request. Copper concentrate is advantageous for transportation since it reduces weight and volume. A solution can be reproduced at the time of usage with the addition of a solvent.
Copper Concentrate Properties (Theoretical)
| Molecular Weight | 63.55 |
|---|---|
| Appearance | Reddish Metal |
| Melting Point | 1085 °C |
| Boiling Point | 2562 °C |
| Density | 8.96 g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 1.673 μΩ-cm @ 20 °C |
| Electronegativity | 1.90 Paulings |
| Heat of Fusion | 13.26 kJ ·mol-1 |
| Heat of Vaporization | 300.4 kJ ·mol-1 |
| Poisson’s Ratio | 0.34 |
| Specific Heat | 0.39 kJ/kg K |
| Thermal Conductivity | 401 W ·m-1 ·K-1 |
| Thermal Expansion | (25 °C) 16.5 µm·m-1·K-1 |
| Vickers Hardness | 369 MPa |
| Young’s Modulus | 110–128 GPa |
Copper Concentrate Health & Safety Information
| Signal Word | Danger |
|---|---|
| Hazard Statements | H228-H400 |
| Hazard Codes | F |
| Risk Codes | 11 |
| Safety Statements | 16 |
| RTECS Number | GL5325000 |
| Transport Information | UN 3089 4.1/PG 2 |
| WGK Germany | 3 |
